KUAI HOT SALE USB 90 degere ho'oku'i ho'oku'u ho'oku'u 'ana 19.5MM hao USB AF 'ao'ao plug wahine kumu USB SMT mea ho'opili pololei no ka pona.

ʻO ka wehewehe pōkole:

wehewehe huahana

Inoa mea: USB 3.0 19.5

Ka helu: DC 30V 0.2A

ʻO ke kū'ēʻana: ≥1000mΩ min.500V DC

Ka ikaika dielectric: 250V AC no 1 min

Kūleʻa pili: ≤50mΩ

Ka ikaika hoʻokomo: ≤35N

ʻO ka ikaika unuhi: ≥10N

Hoʻohana:

- Hoʻohana nui ʻia i nā ʻoihana kiʻekiʻe, e like me nā huahana kikohoʻe kikohoʻe, nā lako kamepiula, nā mea pāʻani uila, ke kelepona kelepona kelepona a me nā huahana ʻē aʻe e pono ke uku.

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

Nā mea maikaʻi o ka huahana: ka lawe wikiwiki ʻana, nā laʻana manuahi, nā huahana me ka palapala hōʻoia RoHS, ke kaʻina hana hoʻoheheʻe laser, ke ola pōʻai ʻoi aku ma mua o 300,000 mau manawa, hōʻoia ʻia ma hope o ke kūʻai aku ʻana, kākoʻo ʻenehana a me ke ʻano lawelawe maikaʻi.
Nā kahua noi: Kamepiula USB awa waho, ka hoʻouka ʻana i nā lako, nā mea kani a me nā lako, nā mea uila uila, nā mea pono hale, nā huahana palekana
ʻO nā ikaika o ka hale hana: me 13 mau makahiki o ka ʻoihana ʻoihana, ua hala ka ʻoihana i ka ISO9001 palapala hōʻoia, he nui o nā palapala patent, ʻoi aku ma mua o 5300 mau mea kūʻai aku hui, nui nā mea kūʻai aku o nā hui i helu ʻia, 106 mau limahana, 12 mau mīkini paʻi, 18 injection molding machines, 26 piha- nā mīkini hui ʻakomi, 32 mīkini hoʻāʻo piha piha, 21 mīkini hoʻāʻo semi-akomi, 12 mīkini hoʻāʻo ola a me 25 mau mea hoʻāʻo ʻē aʻe
MAKEMAKE:
1.Material hoakaka:
1) MATERIAL INSULATION MATERIAL THERMOPLASTIC.
2) ʻĀPILI: COPPER ALLOY / SPCC, T: 0.30mm
PLATING:NIKEL
3) KĀMĀLĀWAI: COPPER ALLOY, T: 0.25mm
PLATING: GULA/TIN PLATED.
2. ELECTRICAL ANOAI:
1) INSULATION RESISTANCE: 100MΩ MIN.
2) KA HOʻOPIʻI HOʻOPIʻI: 30mΩ MAX.
3) ME KA VOLTAGE: 500V AC.
3.NĀ MEA MECHANICAL:
1) KA MANA HOOKO: 3.57Kgf MAX.
2) KA MANA HANA: 1.02Kgf MIN.
KA IKE KAUOHA
Kaiapuni mālama: ka ʻāina wela o ka lumi maloʻo, e pale i ka hoʻopili ʻana me ka ʻakika a me ke anuanu

NĀ KĀNĀ ʻĀMĀNĀ MAU: Inā ʻaʻole i hōʻike ʻia ke ʻano maʻamau o nā kūlana ATMOSPHERIC no ka hana ʻana i nā ana a me nā hoʻāʻo ʻana e like me kēia:
(1) MAWENA KINO A ME KA HANA: 5ºC A 35 ℃
(2) MA waena o nā alakaʻi ʻaʻole e hoʻopili: 45% a 85%
(3) PILI: 86Kpa I 106Kpa
SOLDERA BILITY HO'A'O: E ho'opio 'ia ka piko o na pauku i ka 1mm i loko o ka 'au'au kū'ai o 250±5℃ NO 5±0.5 kekona.
Kū'ē i ka ho'āʻo wela:
KĀNĀ KUAI KUʻAI HOʻI:
PREHEAT: E 180 .120 ℃ S MAHOPE o ka komo ʻana o ka PCB i loko o ka lako kūʻai.
KA MAHELE KI'EWAI: E hiki ke ana ma ka ili keleawe i ka wela o 260±5 me ka 20 kekona.℃
KĀNĀNĀ HĀLĀ: BIT MAHELE 330 ± 5 ℃ MANAWA NO KA KU'I IRON3 ± 0.5 SEC ʻAʻole naʻe e hoʻopili ʻia ke koʻikoʻi nui i ka TERMINAL.