Kūʻai wela USB 2.0 wāwae kūlou 3 papa noho wahine me ka shrapnel
Nā pono huahana: lawe wikiwiki, nā laʻana manuahi, nā huahana me ka palapala hōʻoia RoHS, ke kaʻina hana soldering laser, ke ola pōʻaiapuni o nā manawa he 300,000, ka lawelawe ma hope o ke kūʻai aku i hōʻoia ʻia, ke kākoʻo loea a me ke ʻano lawelawe maikaʻi
Nā kahua noi: Kamepiula USB waho puka, nā lako hoʻouka, nā mea kani a me nā lako, nā mea uila mea kūʻai aku, nā lako hale, nā huahana palekana
Nā ikaika o ka hale hana: me 13 mau makahiki o ka ʻike ʻoihana, ua hala ka ʻoihana i ka palapala hōʻoia ISO9001, he nui nā palapala hōʻoia patent, ʻoi aku ma mua o 5300 mau mea kūʻai aku hui pū, he nui nā mea kūʻai aku o nā ʻoihana i helu ʻia, 106 mau limahana, 12 mau punches lako, 18 mau mīkini hoʻoheheʻe injection, 26 mau mīkini hui piha piha, 32 mau mīkini hoʻāʻo piha piha, 21 mau mīkini hoʻāʻo semi-automatic, 12 mau mīkini hoʻāʻo ola a me 25 mau lako hoʻāʻo ʻē aʻe.
NĀ MEA HOʻOMANAʻO:
1. MEA:
1.1 HALE:PA6T+30% G/F, KALA:ʻELEʻELE,UL94V-0;
1.2 PILI: PHOSPHOR BRONZE
1.3 PŪPŪ: PHOSPHOR BRONZE A I ʻOLE SK7
1.4 HOʻOKAʻAWALE ʻIA: PHOSPHOR BRONZE A I ʻOLE SK7
1.5 PŪPŪ HOPE: SPCC
2. HOʻOPAʻA:
2.1 PILI:
KA PALA ʻANA O KE GULA (E NĀNA I KA PAPA) MA KA WAHI PILI.
100u” MIN. PALAPALA TIN ʻĀLOHILOHI MA KA HOLO SOLDER
ʻĀpana, 50u” MIN. NICKEL UNDERPLATING ALL,
2.2 PŪPŪ:
100u” MIN. KA PALAPALA NIKELA MA LALO.
2.3 HOʻOKAʻAWALE ʻIA: SHELL: 100u” MIN. NICKEL PLATED
2.4 PŪPŪ HOPE: 100u” MIN. I PAʻA ʻIA ME KA NIKELA.
3. NĀ ʻANO UILA:
KA LOILOI O KĒIA MANAWA: 0.5Amper Maximum
UILA: 30V AC.
KA PAʻA ʻANA O KA PILI: FORCE: 0.7KGF MINIMUM
KŪ'Ē I KA PILI ʻANA: 30 MILLIOHMS NUI LOA.
KŪ'Ē I KA HOʻOMALU ʻANA: 1000MEGOHMS KA LIMIMA.
UILA KŪPAʻA DIELECTRIC: 750V AC MA KE ELEVEL SEELE.
KA MAHANA MAIKAʻI: -55℃~85℃.
NĀ KŪLANA LEWA MAʻAMAʻA: KE ʻOLE I KAHAKAHA ʻIA ʻĒ AʻE ʻO KE ʻANO KŪLANA O NĀ KŪLANA LEWA NO KA HANA ʻANA I NĀ ANA A ME NĀ HOʻĀʻO ʻANA E LIKE MEA:
(1) MA WAENA O KE KINO A ME KE ALA KĀLĀ: 5ºC A I 35 ℃
(2) ʻAʻole e pili ma waena o nā alakaʻi: 45% a i 85%
(3) KAOMI: 86Kpa A I 106Kpa
Hoʻāʻo Kūpono SOLDERA: E hoʻoluʻu ʻia ka piko o nā kikowaena i 1mm i loko o ka ʻauʻau SOLDER o 250 ± 5 ℃ no 5 ± 0.5 kekona
KE KŪ'Ē I KA HO'Ā'O WELA SOLDERING:
NĀ KŪLANA HOʻOHANA HOU:
E HOʻOMEHANA MUA: PONO KA MAHANA MA KA ʻILI PEPA KOPE I KA 180 .120 ℃ S MA HOPE O KE KOMO ʻANA O KA PCB I LOKO O NĀ LAKO HOʻOHANA.
ʻO ka mahana kiʻekiʻe loa: Pono ka mahana ma luna o ka ʻili foil keleawe e hōʻea i ka mahana kiʻekiʻe o 260 ± 5 me 20 kekona. ℃
ʻANO HAO KŪʻAI: MAHANA WELA 330±5℃ MANAWA NO KA HAO KŪʻAI 3±0.5 SEK EIA NAʻE, ʻAʻOLE E HOʻOPIHA ʻIA KE KAOMI NUI I KE KINOKI.
